Ultrasonic semiconductor spray coating machine

Ultrasonic semiconductor spray coating machine

Ultrasonic semiconductor atomization spraying is a precision thin-film deposition technology that uses high-frequency ultrasonic energy to atomize semiconductor materials (such as photoresists and conductive materials) into fine, uniform droplets. These droplets are then precisely sprayed onto the substrate surface using a carrier gas, resulting in high-quality, uniform thin-film coatings. This technology offers advantages such as high efficiency, high precision, low material loss, and thin, uniform coatings. It is widely used in semiconductor manufacturing, new energy, and glass coatings, replacing traditional spray methods.

Working Principle

1. Ultrasonic Atomization:

The core of the device is the ultrasonic nozzle, which contains a transducer that converts electrical energy into high-frequency mechanical vibrations.

2. Liquid Atomization:

As liquid (solution, sol, or suspension) flows through the nozzle, the vibrating atomizer generates vibrations. When the vibration amplitude exceeds the liquid's surface tension, the liquid is broken into micron-sized droplets.

3. Carrier Gas Delivery:

The atomized droplets are then evenly transported to the substrate surface by a predetermined amount of carrier gas (such as air).

4. Thin Film Deposition:

Droplets are deposited on the substrate, forming a continuous thin film coating.

Advantages in Semiconductor Applications

High Precision and Uniformity:

The ability to deposit ultra-thin and uniform thin film coatings is crucial for applications in semiconductor manufacturing, such as photoresists, conductive films, and insulating films, which require extremely high precision.

Reduced Material Loss:

Compared to traditional spraying, ultrasonic spraying produces virtually no droplet bounce or excess splashing, increasing material utilization several times, making it particularly suitable for coating expensive materials.

Soft Spraying:

The spraying process is gentle and does not damage the substrate, making it suitable for fragile semiconductor materials and electronic components.

Diversified Nozzles:

Nozzles of varying widths, lengths, shapes, and flow rates can be selected to meet specific application requirements, enabling uniform coating of localized or large areas.